Method of manufacturing film carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 2, 1991
Issued Date -
N/A
app pub date -
Dec 1, 1989
filing date -
Mar 4, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a film carrier comprising a resin base film and a rolled copper foil laminated thereon, said rolled copper foil forming leads for mounting semiconductor chips or other electronic components in place, characterized in that said rolled copper foil is made of a copper alloy composition consisting essentially of a total of 0.005 to 1.5% by weight of one or two or more selected from a group consisting of
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