Method for simulating a shock pulse

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United States of America Patent

PATENT NO 4495792
SERIAL NO

06490694

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for simulating a shock pulse on an encapsulated component wherein the encapsulated component is placed in a specimen container attached to an end of a pressure bar having a mass and a drop height chosen to simulate the shock pulse. The specimen container attached to the pressure bar is dropped on an anvil and the resulting shock pulse is monitored using strain gauges. Otherwise unencapsulated components may also be tested by this method if the component is surrounded by resilient material before testing.

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Patent Owner(s)

  • MOTOROLA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bai, Monty W Scottsdale, AZ 20 208
Meyer, Alfred B Mesa, AZ 3 14

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