Integrated circuit package-in-package system
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United States of America Patent
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Sep 18, 2007
Issued Date -
N/A
app pub date -
Sep 16, 2005
filing date -
Feb 4, 2005
priority date (Note) -
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Abstract
A package-in-package system is provided including forming a top substrate having a first integrated circuit electrically connected thereto and mounting a second integrated circuit over the first integrated circuit. The system includes forming first electrical connectors on the second integrated circuit and encapsulating the second integrated circuit in a first encapsulant with the first electrical connectors exposed. The system includes mounting the second integrated circuit over a bottom substrate with the first electrical connectors electrically connected thereto and encapsulating the top substrate and the first encapsulant in a second encapsulant.
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