Apparatus and method for a wafer level chip scale package heat sink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 12, 2005
Grant Date -
N/A
app pub date -
Dec 5, 2002
filing date -
Dec 5, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flip chip semiconductor package with an integral heat sink is disclosed as well as a technique for creating individual heat sinks by applying a conductive layer to the back surface of a wafer containing integrated circuitry before singulation. According to one aspect of the invention, an adhesive layer is applied to the back surface of a semiconductor wafer. A layer of conductive material such as copper is then attached to the back surface of the wafer using the previously applied adhesive. The wafer is then singulated to create individual semiconductor packages with superior heat transfer properties.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully