Method and apparatus to facilitate transport of semiconductor wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6981594
SERIAL NO

10463974

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An assembly to facilitate the transport of semiconductor wafers comprises rigid first and second end plates, and a plurality of interconnected flexible pockets provided between these first and second end plates. Each of the pockets is configured to store a semiconductor wafer therein. A method of facilitating the transport of semiconductor wafers comprises inserting semiconductor wafers into pockets of a wafer transport assembly, the assembly having rigid first and second end plates, and a plurality of interconnected flexible pockets attached therebetween. The method further comprises collapsing the pockets down onto the semiconductor wafers by moving the first end plate toward the second end plate. A method of fabricating an assembly to facilitate the transport of semiconductor wafers comprises providing a plurality of interconnected flexible pockets between rigid first and second end plates, each of these pockets being configured to store a semiconductor wafer therein.

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Patent Owner(s)

  • NATIONAL SEMICONDUCTOR CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sarver, Roger P Gorham, ME 2 10

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