Method of polishing semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 18, 2001
Grant Date -
N/A
app pub date -
Aug 3, 1998
filing date -
Sep 4, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultrasonic transmitting unit transmits an ultrasonic wave to a slurry supply pipe. A polishing slurry is conveyed under pressure from a slurry supply tank to a slurry outlet via the slurry supply pipe and supplied from the slurry outlet to a surface of a polishing cloth. A wafer carrier holding a semiconductor wafer presses a surface of the semiconductor wafer against the surface of the polishing cloth coated with the polishing slurry and moves the semiconductor wafer relative to the polishing cloth to polish the surface of the semiconductor wafer. A discharged slurry flown out of the surface of the polishing cloth is discharged via a discharged slurry pipe. The application of the ultrasonic wave allows abrasive particles agglomerated in the polishing slurry in the slurry supply pipe to be re-dispersed into individual forms in the polishing slurry.
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