High temperature high pressure tag
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United States of America Patent
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Apr 8, 2014
Grant Date -
Nov 3, 2011
app pub date -
Apr 30, 2010
filing date -
Apr 30, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A tag, such as an RFID tag, and system including an RFID tag configured for installation into an object are provided. The tag is configured for use in high temperature and/or high pressure environments such as downhole and subsea applications. The tag includes an electronics module contained within a bead, which is housed in a cavity of a carrier. The bead is surrounded by a protective fluid-like fill material to provide protection to the electronics module and bead and provide fluid-like properties to the electronics module to reduce or eliminate point stresses on the electronics module. The geometry of the tag is such that the entire outline of the tag is contained within the geometry of the object to provide structural protection of the tag.
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