Semiconductor device package having a semiconductor element with resin
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United States of America Patent
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Apr 10, 2007
Grant Date -
Sep 29, 2005
app pub date -
Mar 25, 2005
filing date -
Mar 25, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.
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