Post passivation interconnect structures and methods for forming the same

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United States of America Patent

PATENT NO 9553066
APP PUB NO 20150130057A1
SERIAL NO

14603881

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Abstract

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A device includes a metal pad, a passivation layer overlapping edge portions of the metal pad, and a first polymer layer over the passivation layer. A Post-Passivation-Interconnect (PPI) has a level portion overlying the first polymer layer, and a plug portion that has a top connected to the level portion. The plug portion extends into the first polymer layer. A bottom surface of the plug portion is in contact with a dielectric material. A second polymer layer is overlying the first polymer layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Wei Hsin-Chu, TW 910 8162
Chen, Ying-Ju Tuku Township, TW 186 1208

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