Power device package and semiconductor package mold for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8258622
APP PUB NO 20080203559A1
SERIAL NO

12011844

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Abstract

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Provided are a power device package coupled to a heat sink using a bolt and a semiconductor package mold for fabricating the same. The power device package includes: a substrate; at least one power device mounted on the substrate; a mold member sealing the substrate and the power device; and at least one bushing member fixed to the mold member to provide a through hole for a bolt member for coupling a heat sink to the mold member.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR COMPONENTS INDUSTRIES LLC5005 E MCDOWELL ROAD MAILDROP A700 PHOENIX AS 85008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Keun-hyuk Gyeonggi-do, KR 17 257
Lim, Seung-won Gyeonggi-do, KR 28 394
Park, Sung-min Seoul, KR 50 441

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