Integrated circuit device, semiconductor substrate, and test system including the integrated circuit device

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United States of America Patent

PATENT NO 11747393
APP PUB NO 20220317179A1
SERIAL NO

17703535

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Abstract

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An integrated circuit device, a semiconductor substrate, and a test system including the integrated circuit device are disclosed. The integrated circuit device includes a power terminal configured to receive a source voltage, a power via connected to the power terminal and passing through at least one of a number of layers, a number of inductive vias arranged apart from the power via and passing through at least one of the number of layers, a number of wirings connected to ends of at least some of the number of inductive vias and configured to form a coil wound in toroidal form together with the number of inductive vias, around the power via, and a test terminal configured to output an induced voltage in the coil externally of the integrated circuit device, in response to the supply of the source voltage.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huh, Sungoh Suwon-si, KR 1 0
Kim, Donghee Seoul, KR 31 86
Kwon, Daehyun Hwaseong-si, KR 10 0

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