Electronic package with bonded structure and method of making
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 25, 2001
Grant Date -
N/A
app pub date -
Oct 28, 1999
filing date -
Nov 5, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or about the same thermal expansion coefficient as the substrate to the semiconductor chip's side surface of the substrate. This reduces warp and deformation caused by temperature changes during package operation.
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