Circuit board device and board connector
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United States of America Patent
Stats
-
Aug 9, 2022
Grant Date -
Aug 12, 2021
app pub date -
Jun 18, 2019
filing date -
Jun 22, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
It is aimed to prevent the breakage of solder joint portions due to the thermal deformation of a molded body. A circuit board device (A) includes a circuit board (10), a cover (32) and a molded body (52) to be provided on the circuit board (10), and a board connector (11) to be surface-mounted on the circuit board (10). The board connector (11) includes a housing (13) and metal members (24, 29) integrally mounted in or on the housing (13). The board connector (11) is surface-mounted on the circuit board (10) by solder-joining the metal members (24, 29). The molded body (52) is made of synthetic resin and surrounds the circuit board (10) and the metal members (24, 29) in a solder joint state. The cover (32) is embedded in the molded body (52) while being disposed to surround the metal members (24, 29).
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