Mechanism for varying the spacing between sputter magnetron and target

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7674360
APP PUB NO 20050133365A1
SERIAL NO

10942273

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A lift mechanism for and a corresponding use of a magnetron in a plasma sputter reactor. A magnetron rotating about the target axis is controllably lifted away from the back of the target to compensate for sputter erosion, thereby maintaining a constant magnetic field and resultant plasma density at the sputtered surface, which is particularly important for stable operation with a small magnetron, for example, one executing circular or planetary motion about the target axis. The lift mechanism can include a lead screw axially fixed to the magnetron support shaft and a lead nut engaged therewith to raise the magnetron as the lead nut is turned. Alternatively, the support shaft is axially fixed to a vertically moving slider. The amount of lift may be controlled according a recipe based on accumulated power applied to the target or by monitoring electrical characteristics of the target.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Peijun Saratoga, US 132 3330
Hong, Ilyoung Richard San Jose, US 8 183
Lowrance, Robert B Los Gatos, US 96 2200
Lubben, Daniel C San Jose, US 13 330
Miller, Michael Andrew Sunnyvale, US 10 289
Rosenstein, Michael Sunnyvale, US 34 1469
Sankaranarayan, Sreekrishnan Santa Clara, US 1 25
Yoshidome, Goichi San Jose, US 31 530
Young, Donny San Francisco, US 23 295

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