Assembly structure and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11621220
APP PUB NO 20220310500A1
SERIAL NO

17213006

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Abstract

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An assembly structure and a method for manufacturing an assembly structure are provided. The assembly structure includes a wiring structure and a semiconductor element. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the at least one dielectric layer, and defines an accommodating recess recessed from a top surface of the wiring structure. The wiring structure has a smooth surface extending from the top surface of the wiring structure to a surface of the accommodating recess. The semiconductor element is disposed in the accommodating recess.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yung-Shun Kaohsiung, TW 20 58
Huang, Chih-Yi Kaohsiung, TW 24 42
Hung, Chih-Pin Kaohsiung, TW 70 766
Lee, Teck-Chong Kaohsiung, TW 53 194

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