Semiconductor package structure and method for forming the same

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PATENT NO 11984378
APP PUB NO 20220367311A1
SERIAL NO

17319707

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Abstract

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A semiconductor package structure includes an interposer substrate formed over a package substrate. The structure also includes a die disposed over the interposer substrate. The structure also includes a first heat spreader disposed over the package substrate. The structure also includes a second heat spreader disposed over the die and connected to the first heat spreader. The coefficient of thermal expansion (CTE) of the first heat spreader and the coefficient of thermal expansion of the second heat spreader are different.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeng, Shin-Puu Hsinchu, TW 756 15932
Lin, Po-Yao Zhudong Township, Hsinchu County, TW 217 994
Lin, Yu-Sheng Zhubei, TW 154 516
Wang, Chin-Hua New Taipei, TW 94 56
Yeh, Shu-Shen Taoyuan, TW 131 79

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