Circuit board and semiconductor device
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United States of America Patent
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Nov 17, 2009
Grant Date -
Aug 3, 2006
app pub date -
Jan 27, 2006
filing date -
Feb 3, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device, includes: a semiconductor substrate; a multilayered interconnect structure formed on the semiconductor substrate; a terminal for flip-chip packaging arranged on the surface of the multilayered interconnect structure; and a spiral inductor formed to enclose the terminal for flip-chip packaging, in a plan view, which is not electrically connected with the spiral inductor. The spiral inductor may be provided for peaking by which the gain reduction caused in a high frequency is compensated.
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