Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same

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United States of America Patent

PATENT NO 7253703
APP PUB NO 20050128027A1
SERIAL NO

10959313

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An air-gap type thin film bulk acoustic resonator (FBAR) and method for fabricating the same. Also disclosed are a filter and a duplexer employing the air-gap type FBAR. The air-gap type FBAR includes: a first substrate having a cavity part at a predetermined region on its upper surface; a dielectric film stacked on the upper part of the first substrate; a first air gap formed between the first substrate and the dielectric film; a stacked resonance part including a lower electrode/piezoelectric layer/upper electrode formed on the upper part of the dielectric film; a second substrate having a cavity part at a predetermined region on its lower surface and joined to the first substrate; and a second air gap formed between the stacked resonance part and the second substrate. A thin film of predetermined thickness made of a liquid crystal polymer (LCP) may be used as the dielectric film.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ha, Byeoung-ju Yongin-si, KR 32 262
Hwang, Jun-sik Ohsan-si, KR 39 315
Park, Yun-kwon Dongducheon-si, KR 57 438
Song, In-sang Seoul, KR 128 1138

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