Multi-chip package and method of manufacturing the same
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United States of America Patent
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Feb 9, 2016
Grant Date -
Aug 28, 2014
app pub date -
Apr 10, 2014
filing date -
Dec 9, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-chip package may include a package substrate, a first semiconductor chip, a second semiconductor chip and a supporting member. The first semiconductor chip may be arranged on an upper surface of the package substrate. The first semiconductor chip may be electrically connected with the package substrate. The second semiconductor chip may be arranged on an upper surface of the first semiconductor chip. The second semiconductor chip may be electrically connected with the first semiconductor chip. The second semiconductor chip may have a protrusion overhanging an area beyond a side surface of the first semiconductor chip. The supporting member may be interposed between the protrusion of the second semiconductor chip and the package substrate to prevent a deflection of the protrusion. Thus, the protrusion may not be deflected.
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