Rapid thermal response induction heating system for platen embossing
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United States of America Patent
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Jun 17, 2008
Grant Date -
Nov 1, 2007
app pub date -
May 1, 2006
filing date -
May 1, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An induction heating system for the manufacturing of optical memory microstructure, wherein the thermal cycle allows the process web to be rapidly heated to the relaxation and re-flow temperature, followed by cooling to the optimum separation temperature in under 10 seconds total process time. The rapid response heating system of the present invention may be achieved through the use of one or rotating asymmetrical induction heating coils which are embedded in the platen(s) of the embossing device.
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