MEMS speaker and speaker assembly structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11895464
APP PUB NO 20230217192A1
SERIAL NO

17880701

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Importance

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Abstract

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A MEMS speaker includes a substrate, a vibration sounding portion and a baffle plate with a through hole. The baffle plate, the substrate and the vibration sounding portion form a sounding inner cavity, and a volume of the sounding inner cavity can adjust a resonant frequency of the sounding inner cavity, so that the resonance frequency of the sounding inner cavity resonate with a preset frequency of the MEMS speaker. A speaker assembly structure further provided includes a speaker, a fixing portion, and a baffle plate, the speaker and the baffle plate together enclose and form a sounding inner cavity, the fixing portion and the speaker are fixedly connected together and form a sealing structure. A sound pressure level of the MEMS speaker and the speaker assembly structure is high and harmonic distortion of the MEMS speaker and the speaker assembly structure is small.

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Patent Owner(s)

Patent OwnerAddress
AAC MICROTECH (CHANGZHOU) CO LTDNO 3 CHANGCAO ROAD HI-TECH INDUSTRIAL ZONE WUJIN DISTRICT CHANGZHOU CITY JIANGSU PROVINCE P R CHINA CHANGZHOU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Shiyang Shenzhen, CN 10 0
Dan, Qiang Shenzhen, CN 12 0
Li, Yang Shenzhen, CN 1024 6574
Shen, Yu Shenzhen, CN 85 623
Zhou, Yiwei Shenzhen, CN 12 0

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