Method and device for manufacturing laminated plate

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United States of America Patent

PATENT NO 7101455
SERIAL NO

10129037

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a method for producing a laminate suitable for a flexible circuit board which is free from visual defects such as wrinkles and curls that appear when a plurality of laminating materials containing a thermally fusible laminating material are formed by thermally laminating these materials each other using a thermal-press forming device, which comprises the steps of: arranging a heat resistant protective material between a pressing surface and the laminating materials, laminating the materials by thermal pressure at not lower than 200.degree. C., wherein the bonded laminating materials are in contact with the protective material, cooling the bonded laminating materials, and peeling off the protective material from the bonded laminating materials, whereby the laminate with less nonuniformity in pressurization, a uniform surface, and a good inter-layer adhesion, and the method and device for producing the laminate can be provided, more particularly, the thermal pressure and forming is performed by a thermal-press forming device having at least a pair of metal rolls.

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Patent Owner(s)

  • KANEKA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furutani, Hiroyuki Osaka, JP 25 172
Fushiki, Yasuo Kyoto, JP 22 249
Hase, Naoki Shiga, JP 39 129
Kataoka, Kosuke Shiga, JP 5 40

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