Low application temperature hot melt adhesive for cigarette preparation
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United States of America Patent
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May 27, 2003
Grant Date -
N/A
app pub date -
Apr 26, 1999
filing date -
Apr 26, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A cigarette filter, process to manufacture, wherein a low application temperature ethylene copolymer based hot melt adhesive is applied to porous and/or nonporous plugwrap paper. As used herein, low application temperatures are temperature between 200.degree. F. and 300.degree. F. (93.degree. C. and 149.degree. C.), preferably, 240.degree. F. to 275.degree. F. (115.degree. C. to 135.degree. C.).
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