Polymer film laminated substrate and method for producing flexible electronic device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11267216
APP PUB NO 20200180259A1
SERIAL NO

16479825

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Abstract

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[Problem] To provide a polyimide film laminated substrate in which stable peeling with a constant low force from an inorganic substrate is enabled when a polyimide film is to be peeled from an inorganic substrate even after heat treatment at a temperature exceeding 500° C. is performed.

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Patent Owner(s)

  • TOYO BOSEKI KABUSHIKI KAISHA T/A TOYOBO CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okuyama, Tetsuo Otsu, JP 42 705
Tokuda, Kaya Otsu, JP 14 1
Tsuchiya, Toshiyuki Otsu, JP 28 172
Watanabe, Naoki Otsu, JP 363 4120
Yamashita, Masahiro Otsu, JP 91 816

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