Fluorine-containing epoxy resin for electrical materials and method for manufacturing same

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United States of America

PATENT NO 11965060
APP PUB NO 20220081507A1
SERIAL NO

17533359

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Abstract

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A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being:

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Patent Owner(s)

  • DAIKIN INDUSTRIES, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Yoshito Osaka, JP 162 2016
Yoshida, Tomohiro Osaka, JP 65 346

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