Composition for forming silica layer, silica layer and electronic device incorporating silica layer

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11201052
APP PUB NO 20200365400A1
SERIAL NO

16874820

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is a composition for forming a silica layer including perhydropolysilazane (PHPS) and a solvent, wherein in an 1H-NMR spectrum of the perhydropolysilazane (PHPS) in CDCl3, when a peak derived from N3SiH1 and N2SiH2 is referred to as Peak 1 and a peak derived from NSiH3 is referred to as Peak 2, a ratio (P1/(P1+P2)) of an area (P1) of Peak 1 relative to a total area (P1+P2) of the Peak 1 and Peak 2 is greater than or equal to 0.77, and when an area from a minimum point between the peaks of Peak 1 and Peak 2 to 4.78 ppm is referred to as a Region B and an area from 4.78 ppm to a minimum point of Peak 1 is referred to as a Region A of the area of Peak 1, a ratio (PA/PB) of an area (PA) of Region A relative to an area (PB) of Region B is greater than or equal to about 1.5.

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Patent Owner(s)

  • SAMSUNG SDI CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Jin-Hee Suwon-si, KR 27 87
Hwang, Byeonggyu Suwon-si, KR 5 2
Jang, Seungwoo Suwon-si, KR 11 4
Jo, Hyeonsu Suwon-si, KR 2 0
Kim, Euihyun Suwon-si, KR 6 6
Kwak, Taeksoo Suwon-si, KR 10 3
Lee, Chungheon Suwon-si, KR 3 0
Lim, Wanhee Suwon-si, KR 3 0
Noh, Kunbae Suwon-si, KR 10 99
Sakong, Jun Suwon-si, KR 4 2

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