Semiconductor package with low and high-speed signal paths
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United States of America Patent
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Apr 27, 2010
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app pub date -
Feb 11, 2005
filing date -
Feb 11, 2005
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Abstract
The semiconductor package includes two electrical contacts and a semiconductor device coupled to opposing sides of a substrate. The substrate defines at least one via extending at least partially there through. The semiconductor device includes a semiconductor low-speed interface electrically coupled to one of the electrical contacts through the via, and a semiconductor high-speed interface electrically coupled to flexible tape. The flexible tape is also electrically coupled to the other one of the electrical contacts.
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