Method of manufacturing LED rows using a temporary rigid auxiliary carrier
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United States of America Patent
Stats
-
Aug 27, 1991
Grant Date -
N/A
app pub date -
Apr 2, 1990
filing date -
Mar 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An assembly process for strip-shaped LED chips (112) in a row on a solid metal carrier (M) is to be specified. The observation of strictest tolerances in all three directions, i.e. in view of division spacing, trueness to line and surface planarity, is thereby required. On the other hand, an optimum thermal coupling to the metal carrier (M) is required for the illumination of the high dissipated heat from the LEDs (113) of a LED chip (112). The LED chips (112) are applied on to the metal carrier (M) in a transfer process. To that end, the LEDs have their faces glued onto an auxiliary carrier (H1) positioned with high precision and the LED row (114) prefabricated in this fashion is then soldered onto the previously solder-coated metal carrier (M). The auxiliary carrier (H1) is subsequently removed.
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