Importance

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Abstract

Disclosed are a printed circuit board which buries the leads of electronic parts mounted on a printed board into a coating material to prevent the occurrence of a leak between the leads, and an electronic part designed to suppress the occurrence of cracks in a coating layer formed by coating a coating material on the electronic part and a printed board after the former is mounted on the latter. The printed circuit board comprises a printed board, a frame provided on the soldering-surface side of the printed board to surround all or a part of the soldering surface of the printed board in such a way that the amount of protrusion of the frame from the soldering surface of the printed board is made larger than that of protrusion of the leads of the electronic parts from the soldering surface side of the printed board, and a coating material injected inside the frame to bury the leads that protrude from the printed board. The electronic part comprises a case body having side walls nearly perpendicular to the mount surface of the electronic part. The electronic part has a mount surface at which the electronic part is to be attached to the printed board when mounted thereon. The mount-surface side outer peripheral portions of the side walls of the case body are each formed to have a curved surface so that as the outer peripheral portions approach the mount surface, the outer peripheral portions extend further outward.

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First Claim