Shiftless wafer blades

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11688620
APP PUB NO 20220392796A1
SERIAL NO

17846431

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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In an embodiment, a system includes: a cassette comprising a slit opening configured to house a wafer; a blade configured to move the wafer to and from the slit opening by extending into the slit opening, wherein a blade thickness of the blade is at most ⅖ of a height of the slit opening and wherein the blade is configured to secure the wafer within a pocket on the blade that is at least ⅔ of a wafer thickness of the wafer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Chih Hsin-Chu, TW 188 1267
Lee, Ching-Ling Hsin-Chu, TW 6 31
Lee, Ren-Dou Hsinchu, TW 21 38
Yu, Yao-Min Hsin-Chu, TW 3 3

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