Implementation of protection layer for bond pad protection
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United States of America Patent
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Sep 12, 2006
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app pub date -
Apr 28, 2004
filing date -
Apr 28, 2004
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Abstract
A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond pad. The substrate is die-sawed and the bond pad protection layer is removed by heating.
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