Substrate processing method and substrate processing apparatus

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United States of America Patent

PATENT NO 11049723
APP PUB NO 20200219730A1
SERIAL NO

16736964

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Abstract

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A substrate processing method includes: maintaining an atmosphere in contact with at least a surface of a substrate on which a first material that is a metal and a second material that is a material other than the first material are exposed, as a deoxidized atmosphere; supplying a film forming material, which selectively forms a film on the first material among the first material and the second material, to the surface of the substrate in a state where the deoxidized atmosphere is maintained by the maintaining; performing a surface treatment of the second material in a state where the film is formed on a surface of the first material supplied in the supplying the film forming material; and removing the film from the surface of the first material after the performing the surface treatment.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higuchi, Rintaro Kumamoto, JP 4 1
Hiroshiro, Koukichi Kumamoto, JP 18 53
Kagawa, Koji Kumamoto, JP 18 22
Sekiguchi, Kenji Kumamoto, JP 51 655

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