High frequency package device with internal space having a resonant frequency offset from frequency used
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United States of America Patent
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Feb 15, 2011
Grant Date -
Jan 11, 2007
app pub date -
Mar 6, 2006
filing date -
Jul 11, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A lid forms an internal space on a bottom plate together with a plurality of side walls. A dielectric plate on the bottom plate in the internal space has a smaller width than an inner surface of the lid. A projection on the inner surface of the lid has a surface area, where a distance between the projection and the bottom plate where the projection is provided is shorter than a distance between the lid and the bottom plate where the projection is not provided. The lid and the projection are coupled to pass a current therebetween. The inner surface of the lid extends further toward an inner surface of one of the side walls than does the projection. The bottom plate, the side walls, the lid, and the projection are composed of metal material. The lid and the projection are composed of the same metal material.
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