Embedded electronic component structure and fabrication method thereof
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United States of America Patent
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Jan 11, 2011
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N/A
app pub date -
Dec 12, 2007
filing date -
Jan 31, 2007
priority date (Note) -
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Abstract
An embedded electronic component structure and a method for forming the same are provided, wherein the embedded electronic component structure comprises a lower laminating layer, a first clamping layer, a dielectric layer, a second clamping layer, an electronic component, an upper laminating later and a via interconnection. The first clamping layer is disposed on the lower laminating layer. The dielectric layer is disposed on the first clamping layer. The second clamping layer is located on the dielectric layer. The electronic component is embedded in the dielectric layer, wherein the lower surface of the electronic component contacts the first clamping layer and the upper surface thereof contacts the second clamping layer. The upper laminating layer covers the second clamping layer. The via interconnection is adjacent to the electronic component and penetrate the dielectric layer to respectively connect the first clamping layer and the second clamping layer.
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