Method for manufacturing a semiconductor device
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United States of America Patent
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Mar 29, 2011
Grant Date -
Sep 25, 2008
app pub date -
Mar 11, 2008
filing date -
Mar 20, 2007
priority date (Note) -
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Abstract
A method for manufacturing a semiconductor device having a substrate on which conductor wiring is disposed, electrodes provided to the conductor wiring, a semiconductor element connected to the electrodes, and a sealing member that covers the semiconductor element, comprises; mounting a plurality of semiconductor elements on the substrate in the X-axial direction and the Y-axial direction, forming marks in the X-axial direction, supplying the sealing material onto the substrate to continuously-covering the plurality of semiconductor elements arranged in the X-axial direction along the marks, dicing the sealing member and the substrate in the Y-axial direction to form cut planes of the sealing member and the substrate in substantially one plane and being a pair of cut planes opposite one another.
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