Dishing reducing in tungsten chemical mechanical polishing

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10570313
APP PUB NO 20160237315A1
SERIAL NO

15014210

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Abstract

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This invention pertains to slurries, methods and systems that can be used in chemical mechanical planarization (CMP) of tungsten containing semiconductor device. Additives are used to reduce the dishing on large and small feature sizes (large bond pad as well as fine line structures) without retarding the tungsten removal rate.

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Patent Owner(s)

  • VERSUM MATERIALS US, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lew, Blake J Scottsdale, US 4 25
Shi, Xiaobo Chandler, US 79 342
Stender, Matthias Phoenix, US 30 491

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