Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support
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United States of America Patent
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Mar 6, 2007
Grant Date -
Sep 29, 2005
app pub date -
May 9, 2003
filing date -
May 22, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.
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