Multi-die package
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United States of America Patent
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May 27, 2003
Grant Date -
N/A
app pub date -
Jun 12, 2002
filing date -
Jun 12, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-chip package which has a L-shaped plate and a plurality of dies arranged on the L-shaped plate. The L-shaped plate has a die package region, a plurality of solder bump pads disposed in the die package region, a plurality of pins electrically connected to a printed circuit board (PCB), and an internal circuit inside the L-shaped plate electrically connected to the plurality of solder bump pads and corresponding pins. Each die includes a plurality of bonding pads on an active surface of the die, and the bonding pads are electrically connected to corresponding solder bump pads.
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