Anisotropic carrier for high aspect ratio fanout

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11393701
APP PUB NO 20210050229A1
SERIAL NO

16732501

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Abstract

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A method includes coating a release film over a carrier. The carrier includes a first material having a first Coefficient of Thermal Expansion (CTE), and a second material having a second CTE different from the first CTE. The method further includes placing a device die over the release film, encapsulating the device die in an encapsulant, and planarizing the encapsulant until the device die is revealed.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Chien Ling Hsinchu, TW 114 2176
Yu, Chen-Hua Hsinchu, TW 2036 41095

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