Method of making microwave circuit package
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United States of America Patent
Stats
-
Nov 10, 1998
Issued Date -
N/A
app pub date -
Nov 1, 1996
filing date -
Mar 2, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. An unlimited number of layout designs are possible within an ?s! matrix close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.
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