Resin composition and moldings

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United States of America Patent

PATENT NO 6498204
SERIAL NO

08827645

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Abstract

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A resin composition contains a thermoplastic elastomer, natural organic, and silicone. As the thermoplastic elastomer, an olefin thermoplastic elastomer, such as a ethylene-propylene copolymer or the like, can be used. As the thermoplastic elastomer, a styrene thermoplastic elastomer, such as a styrene-butadiene copolymer or the like, can be used. As the natural organic, silk, cellulose, collagen or the like can be used. It is advisable that the content of the natural organic is 5-30 wt %, and the content of silicone is 0.3-10 wt %. Where the natural organic is a fine powder state, it is preferable that the particle size is less than 300 .mu.m. Moldings are sheets or the like, formed by using the aforementioned resin composition.

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Patent Owner(s)

  • IDEMITSU KOSAN CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ubara, Atsuhiko Himeji, JP 8 71

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