Test probe for semiconductor package
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United States of America Patent
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Mar 27, 2007
Grant Date -
Dec 22, 2005
app pub date -
Jun 6, 2005
filing date -
Jun 22, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An embodiment may comprise a test probe to measure electrical properties of a semiconductor package having ball-shaped terminals. The probe may include a signal tip and a ground tip. The signal tip may have a spherical lower surface allowing good contact with a ball-shaped signal terminal. The ground tip may be extended from a lower end of a ground barrel that encloses the signal tip. The ground tip may move independent of the signal tip by means of a barrel stopper and a spring. Thus, the probe can be used regardless of the size of and the distance between the package terminals.
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