Packaged device adapter assembly with alignment structure and methods regarding same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 12, 2005
Grant Date -
Dec 2, 2004
app pub date -
May 30, 2003
filing date -
May 30, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.
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