Shielding structure, semiconductor package structure with shielding structure

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United States of America Patent

PATENT NO 11380625
SERIAL NO

17009601

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Soonheung Gyeonggi-Do, KR 4 3
Cho, Jaeshin Gyeonggi-Do, KR 12 142
Lee, Jyhwan Gyeonggi-Do, KR 1 0

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