Stacked integrated circuit package system with intra-stack encapsulation
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United States of America Patent
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Jan 18, 2011
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N/A
app pub date -
Jun 25, 2008
filing date -
Jun 25, 2008
priority date (Note) -
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Abstract
A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect.
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