Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition

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United States of America Patent

PATENT NO 7271100
APP PUB NO 20060014390A1
SERIAL NO

11168412

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Abstract

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A slurry composition includes about 4.25 to about 18.5 weight percent of an abrasive, about 80 to about 95 weight percent of deionized water, and about 0.05 to about 1.5 weight percent of an additive. The slurry composition may further include a surfactant. In a polishing method using the slurry composition, a polysilicon layer may be rapidly polished, and also dishing and erosion of the polysilicon layer may be suppressed.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Kyung-Hyun Seoul, KR 84 855
Ko, Yong-Sun Suwon-si, KR 83 595
Lee, Hyo-Jin Seoul, KR 97 1204

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