Semiconductor device, manufacturing method thereof and mounting board
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United States of America Patent
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-
Jun 11, 2002
Grant Date -
N/A
app pub date -
May 26, 1998
filing date -
Nov 28, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.
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