Methods for forming memory cell structures

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United States of America Patent

PATENT NO 6486025
SERIAL NO

10047265

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Abstract

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Within a first of a pair of methods for forming a memory cell structure there is employed a sacrificial spacer layer formed adjacent a capacitor structure and subsequently stripped therefrom to provide an air gap void interposed between a bitline stud layer and the capacitor structure. Within a second of the pair of methods for forming a memory cell structure there is employed a topographically variable thickness masking layer as a self aligned mask layer for forming a patterned capacitor plate layer from a topographic blanket capacitor plate layer. The methods provide for readily forming the memory cell structure with enhanced performance.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chi, Min-Hwa Hsinchu, TW 301 5141
Liu, Yuan-Hung Hsin-Chu, TW 45 815
Tsai, Chia-Shiung Hsin-Chu, TW 506 6305
Tu, Yeur-Luen Taichung, TW 254 2468
Yu, Chih-Hsing Hsin-Chu, TW 14 668

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