Mechanism to cross high-speed differential pairs
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United States of America Patent
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Aug 16, 2005
Grant Date -
May 6, 2004
app pub date -
Nov 4, 2002
filing date -
Nov 4, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
According to one embodiment, a printed circuit board (PCB) is disclosed. The PCB includes a first functional unit block (FUB) and differential traces coupled to the first FUB. The first FUB transmits high-speed serial data. The differential traces carry the high-speed serial data from the first FUB. In addition, the differential traces crossover on the same layer of the PCB while maintaining a constant impedance.
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