Hermetically bonding ceramic and titanium with a Ti-Pd braze interface

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United States of America Patent

PATENT NO 7771838
SERIAL NO

11238603

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Abstract

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A component assembly for use in living tissue comprises: a ceramic part; a metal part; and a titanium palladium (Ti—Pd) interface layer for bonding said ceramic part to the metal part. In one embodiment, the interface layer may be formed from a single titanium layer in contact with a single palladium layer, or in other embodiments, may be at least a three layer laminate (Pd—Ti—Pd). A microstimulator housing comprising a ceramic part, a titanium or titanium alloy part sandwiching the Ti—Pd interlayer may be employed to create a eutectic bond that is strong and hermetic.

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Patent Owner(s)

  • BOSTON SCIENTIFIC NEUROMODULATION CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colvin, Michael S Malibu, US 28 4609
He, Tom Xiaohai Simi Valley, US 46 5522

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